I

  1. Symbol used to designate current.
  2. Interlocked armor of aluminum, bronze, or steel.

I2R = V2/R(Power)

Ohmic formula for irreversible dissipative power loss in watts, where I = current in amperes, R = resistance in ohms, and V = voltage volts.

I/O

Input/Output

IACS

International Annealed Copper Standard

IC

See Integrated Circuit.

IC Chip

See Integrated Circuit.

IC Chip Level

The first of five levels of electronic interconnect device packaging, in which the IC chip is joined directly to the IC package. It is designated Level 0 because it does not require electronic connectors.

IC Package

  1. The combined unit of an IC chip and carrier assembly.
  2. A term for package-to-board electronic interconnect device.

ICE

In-Circuit Emulator. The bridge between hardware and software development systems. Hardware-software facility for real time 1/0 debugging. A microprocessor is replaced by a ICE to allow trouble-shooting and debugging of the system. The emulated microprocessor can be stopped, and its registers examined or modified.

ID

Inside Diameter

IDC

Insulation Displacement Connection .

See IDT.

IDT

Insulation Displacement Technology. A termination method in which insulated wire is forced into a slot smaller in width than the diameter of the conductor. The sharp edges of the slot displace the insulation and make a permanent electrical interface between the wire conductor and the walls of the slot.

IDT is Premium line terminology. You will generally see this technology referred to as IDC.

IEC

  1. Interexchange Carrier. A long-distance telephone company.
  2. International Electrotechnical Commission. A U.S. standards organization for metric connectors.

IEEE

Institute of Electrical and Electronics Engineers. A worldwide professional association for electrical and electronics engineers, which sets standards for telecommunications and computing applications.

IEEE 488

An I/O connector used primarily by the data transmission industry.

See also IEEE.

IEEE 1394

A packaging standard applicable to digital and multimedia interconnects. Premium line's IEEE 1394 products include standard six pin to miniature four pin to custom interconnects. These are high speed serial solutions for applications such as PCs, digital cameras, etc.

IF

Intermedate Frequency

IGFET

Insulated-Gate Field Effect Transistor

Ignition Terminal

Solderless terminal designed for use on automotive ignition work.

IIL or I'L

Integrated Injection Logic. One of the newest of the IC logic families, which combines bipolar speed, MOS circuit density, and CMOS low power consumption. Also called I squared L.

Immersed Plating

Contact plating done by immersing part of the pin/terminal in a gold solution for plating. Usually used to selectively plate bandolier pins.

Immersion Plating (Galvanic Displacement)

The chemical deposition of a thin metallic coating over certain base metals by a partial displacement of the base metal. Also called galvanic displacement.

Impedance

Resistance to a given circuit. Resistance is measured with the equation Z=V/I, where V is input voltage, I is current, and Z is impedance. Lowering the ground impedance of a system improves system stability and electrical performance.

Impedance Match

The condition in which the impedance of a component or circuit is equal to the internal impedance of the source, or the surge impedance of a transmission line, thereby giving maximum transfer of energy from source to load, minimum reflection, and minimum distortion.

Impedance Matching Stub

A section of transmission line, pair, or conductor cut to match the impedance of a load. Also called matching stub.

Impedance Matching Transformer

A transformer designed to match the impedance of one circuit to that of another.

Impedance, Characteristic

In a transmission cable of infinite length, the ratio of the dynamic applied voltage to the resultant dynamic current at the point the voltage is applied. Or, the impedance that makes a transmission cable seem infinitely long when connected across the cable's output terminals. For a waveguide, it is the ratio of rms voltage to total rms longitudinal current at certain points on a diameter, when the waveguide is match-terminated.

Impedance, High

Generally, the area of 25,000 ohms or higher.

Impedance, Low

Generally, the area of 1 through 600 ohms.

Impregnate

To fill the voids and interstices of a material with a compound. This does not imply complete fill or complete coating of the surfaces by a hold-free film.

Impulse

See Pulse.

Impurities

Material added to silicon or germanium in the semiconductor manufacturing process in order to create a P-type or N-type section of material, as needed. Materials used as impurities include boron, phosphorous, and arsenic.

IMSA

International Municipal Signal Association