A method of selecting, transporting, and positioning individual devices onto an assembly.
The creation of voltage by applying pressure to a crystal.
See Lead.
The quantity of pins on a PCB per unit area.
An IC package-to-board connector that allows the greatest number of contacts per square inch of PCB space. Also called bed of nails.
The leads sticking out of an IC package.
See Stamping Press.
Premium line tradename for equipment used to insert .025" and .045" square pins into P.C. boards by single pin settings or multi-pin setting equipment.
The nominal distance from center-to-center of adjacent conductors.
Diameter of a circle passing through the center of the conductors in any layer of a multi-conductor cable.
Two rubber insulated, parallel laid, lamp cords with overall braid. 300 in.
A conductor made of one metal only.
See Round Conductor Flat Cable.
High polymeric substances, including both natural and synthetic products, but excluding the rubbers that are incapable of flowing under heat and pressure.
Change in dimensions under load that is not recovered when the load is removed. The creation of a permanent set in the material.
An IC package-to-board connector that is similar in appearance to a chip carrier but with flat, rather than bent, contacts.
A physically-compatible non-reactive chemical added to plastics to make them softer and more flexible, e.g., dioctyl phthalate for PVC plastic.
A PCB hole with deposition of metal on the sides of the hole and on both sides of the base that provides electrical connection from the conductive patters on one side of the PCB that on the opposite side.
The application of a thin coating of metal on metallic components. Plating has the following benefits:
In selective plating only contact areas of terminal are plated to reduce cost.
Plating thickness is measured in micro inches or microns. Tin plating ranges is 100-200 micro inches (2-5 microns). Gold plating ranges from a 5-50 micro inches (0.1-1.3 microns).
Usually a pure form of the metal as the anode from which the metal via a electrochemical plating cell is dissolved and transported to and plated onto the workpiece electrode known as the cathode.
The process of the electro-chemical deposition of a conductive material on the base material (surface holes, etc.) after the base material has been made conductive.
The area of absence of a particular metal from a specific cross-sectional area.
Plating water has special purity requirements. Water that has not met these requirements must be run through a de-ionser before being used in plating. This is called DI water.
A contact material that provides low and consistent surface resistance. It is used in the moving contacts of ultra-sensitive relays, thermostats, and potentiometers. Other elements are added to this precious metal to create alloys with higher mechanical wear resistance. Platinum sometimes can be used to replace gold for plating metal parts. It is resistant to corrosion and film formation.
Plastic Leader Chip Carrier. A chip carrier that has a molded plastic body and generally J formed leads.
See also Chip Carrier.
A building space where environmental air moves but wiring is also allowed. A suspended ceiling is a good example.
A cable that is UL listed as having adequate fire resistance and low smoke producing characteristics for installation without conduit in ducts, plenums, and other spaces used for environmental air.
Wire that is rubber, parallel jacketed, two-conductor, 300 in.
Thermoplastic insulation.
A joint in which a round component pin projects through a hole in a flexible circuit; the pin and conductor are then joined by a conical solder fillet.
For wire management on Premium line Semconn connectors, it provides proper sequencing of wires and proper length for correct termination.
Polyethylene-insulated control cables with nylon sheath on individual conductors. Cables, tape, and polyvinyl chloride jacket. 600 in, 75° C.