See SO.
See SO.
A contact located in an insert or body in such a way that the mating contact is inserted into the unit.
See also Receptacle.
A connector that contains socket contacts, into which a plug connector with male contacts is inserted.
A female contact designed to mate with a male contact. It is normally connected to the live side of a circuit.
A sleeve that holds the contact spring in the correct position within the socket contact.
Protrusions from the connector body in the form of tabs which is for snap fit mounting of external accessories are used.
Process of joining two metals with a fusable alloy or solder that melts below 800º F (427º C).
See also Hard Soldering.
A small outline IC that is a surface mount variety of DIP.
Small Outline J-lead. A silicon semiconductor photovoltaic cell which is a direct current voltage source. It converts solar energy directly into electrical energy.
An alloy (usually 62/38 (eutectic) or 10/90 tin/lead alloy) that melts at relatively low temperature, and which is used to join or seal metals with higher melting points. Commonly used for connector terminations. Terminations can be individually hand-soldered or, when done in mass quantities, joined by vapor phase or infra-red reflow techniques. Temperature range is about 181 - 190°C.
A contact or terminal that has a cup, hollow cylinder, eyelet, or hook to accept a wire in a conventional soldered termination.
A point at which the connector is soldered directly to the mother board by hand, wave, or dip methods.
A tubular end of a terminal in which a conductor is inserted prior to being soldered. Also the hollow cylinder at the rear of a solder contact, where a wire is inserted and soldered in place.
An eyelet, or hole, in a contact through which a wire may be mechanically connected to the contact prior to soldering.
De-soldering technique that uses a continuous vacuum mode with controlled joint heating and cooling, a hot air jet, and/or heat and air pressure.
A substance that transforms a passive, contaminated metal surface into an active, clean solderable surface.
Method of simultaneously joining several layers of a multilayer circuit in a compact interconnecting system.
A hole in the terminal back end, where a wire is wrapped, and then had soldered to the terminal.
Device to which wire is secured by soldering. Solder Lugs are attached to a PC Board, termination strip, chassis, or electrical component.
A silkscreened PCB coating that keeps solder from contacting selected areas during manufacturing processes.
Liquid compounds formulated for use as the oil in oil intermix wave soldering equipment and as pot coverings on still solder pots.
A mixture composed of minute solder particles, solvent, and flux. Applied by screen or dispensing equipment, it is the technique by which PCBs are soldered by reflow equipment.
An undesirable protrusion of solder from a solidified solder joint or coating.
A heat shrinkable tubing device that contains a predetermined amount of solder and flux used for environmental resistant solder connections and shield termination.
Any of several techniques to test the suitability for soldering of connectors and PCB components. An additional test can be used for plated through-holes and components. They common tests are:
Other tests may be used, as mutually agreed to by a vendor and customer.
Point of bonding between solder and component surfaces.
A connector in which the contact between the conductor and the connector is made by a soldered joint.
Process of joining metallic surfaces with solder, without the melting of the base metals. Soldering is an economical, versatile, and fast termination method. A soldered connection has metallic continuity, and therefore, excellent long term reliability.
A liquid used with wave solder systems that can be intermixed with solder to reduce the surface tension of the solder, promote wetting, and eliminate the formation of dross.
A high purity copper substrate form, iron-plated 0.006 inches to 0.030 inches thick, hot tin dipped in the working area and the remaining surface immunized by nickel-chromium plating. The working area of the tip is usually fabricated for access and maximum heat transfer to the work point.
A capillary action that tends to draw solder or flux up into a PCB during the soldering process and can cause a short circuit. The closed bottom of housing prevents solder wicking.
The joining of two metals by pressure means without the use of solder, braze or any method requiring heat.
Usually refers to a crimped terminal.
Mechanized wire-wrapping systems intended for high production applications.
See Wire-wrap.
A conductor consisting of a single wire.
A silicon or germanium semiconductor device, such as a diode, transistor or integrated circuits or circuits, or equipment or systems made from such devices.
One solid tinned copper wire, plus insulation.
The temperature at which a metal alloy begins to melt.
See also Liquidus.
Small diameter multi-conductor control cable. Neoprene jacket and nylon sheath over polyethylene insulation.
Synchronous Optical Network (in the U.S). Known as Synchronous Optical Hierarchy elsewhere. The fastest time-division multiplexing scheme, allowing channels to be developed at multi Gbps speeds over fiberoptic cables. When SONET customer premises equipment is developed, LAN and PBX channels will be able to ride on the same fiberoptic strand.
In fiber optics, one of three classifications of fiber optic connectors that interconnect a light source (typically a LED) to a fiber optic cable.
A metal piece placed between two conductors in a connector.
Distance between closest edges of two adjacent conductors.
A terminal with a slotted tongue and nearly square sides.
A contact with fork-shaped female members designed to dovetail with spade-shaped male members. Alignment in this type of connection is very critical if good conductivity is to be achieved.
Slotted tongue terminal designed to slip around a screw or stud without removing the nut.
Distance from the reference edge of the first conductor to the reference edge of the last conductor, expressed in decimal inches of centimeters.
See Single Pole, Double Throw.
Frequencies or radiations that exist in a continuous range and have a common characteristic. A spectrum may be inclusive of many spectrums, e.g., the electromagnetic radiation spectrum includes the light spectrum, radio spectrum, infrared spectrum, etc.
Circuit response modeling and simulation per a given electrical excitation in order to judge the electrical and design capabilities of a system.
A container used to organize and protect splice trays.
See Coupler.
The ratio of power emerging from two output ports of a coupler.
A complete Premium line interconnect system that uses a spring-box type contact.
Standard Pack Quantities. A fixed quantity of components.
A packate-to-board interconnect device sometimes referred to as a low-profile socket, made with a spring contact inside a cup, and sealed at the top to keep out contaminants.
Design of a contact, as used in a printed circuit connector or a socket contact, permitting easy, stress-free spring action to provide contact pressure and/or retention.
See Single Pole, Single Throw.
Similar to 5P-1, all thermoplastic, 300 in, 60º C, 75º C, 90º C, 105º C 9-12 ratings, 18 AWG, 2 or 3 conductors.
Similar to 5P-2, all thermoplastic, 300 in, 60º C, 75º C, 90º C, 105º C ratings, 16-18 AWG.
Similar to 5P-3, all thermoplastic, 300 in, 60º C, 75º C, 90º C, 105º C ratings, 10-18 AWG.